Samsung, SK Hynix, Intel put packaging at the heart of future innovation


At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. ... Read more

Bron: DIGITIMES: IT news from Asia
Tags: SamsungIntelSK HynixSeoul
Geplaatst: 31 Oct 2024 - 02:41